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Full hot-air soldering processing
The new generation BT302 Batch Hot Air Reflow Oven is equipped with a full hot air convection system, hot air spray evenly to every corner of PCB board, and avoiding shadow effects and color sensi­tives to temperature sensing deviation, making the heating efficiency of components consistently.

Real-time dynamic thermal control via on-board measuring
BT302 series Reflow Oven has an advanced setting in which you can turn on the real-time dynamic process. The unit can then via real-time feedback from the measuring system which is attached at a strategic location on the PCB surface.

The heater control and fan speed are based on the actual temperature measured on the product. The target temperature is equal to the dynamic measuring system temperature and there is no offset, making this a perfect tool for Prototyping and small series.

Simulated Multi-zone temperature and time setting
BT302 series oven available to set up the dynamic curve by max. 99 points of temperature and timing simulated to the heating process of multi-zone reflow oven.